Bassett Electronic Systems Ltd has extensive PCB assembly capabilities able to meet complex manufacturing requirements.
SMT Assembly
B.E.S operate 6 off Philips surface mount placement lines coupled with DEK solder paste printers and Conceptronic / Heller forced convection reflow ovens.
Placement capabilities range from 0402 to uBGA.
We adopt an extremely flexible approach to assembly management. As our surface mount placement machines are from one manufacturer they are all capable of running any placement program from our database. This offers the benefit of flexible and adaptable production scheduling.
Conventional Assembly
B.E.S offers manual and semi-automatic through-hole insertion with lead free wave soldering from our Blundell CMS400LF.
We can also perform a number of peripheral services such as conformal coating, potting, and device programming.
SMT placement operation
Prototype Assembly
Rapid prototype assemblies are either placed on our Essemtec hand placement line or hand soldered by one of our experienced staff.